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Proceedings Paper

Comparison Of Optical And Mechanical Methods Of Thickness Measurement
Author(s): Albert Feldman; Theodore Vorburger
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Paper Abstract

A variety of techniques is used for the measurement of thin film thicknesses of the order of one micrometer. These techniques include stylus profilometry, multiple beam interferometry, dual beam interferometry, guided waves, channel spectra and ellipsometry. The principles underlying each of the techniques are discussed and where available, experimental comparisons of the techniques are presented. Advantages, disadvantages, and sources of error are also discussed.

Paper Details

Date Published: 15 October 1982
PDF: 8 pages
Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); doi: 10.1117/12.933685
Show Author Affiliations
Albert Feldman, National Bureau of Standards (United States)
Theodore Vorburger, National Bureau of Standards (United States)

Published in SPIE Proceedings Vol. 0342:
Integrated Circuit Metrology I
Diana Nyyssonen, Editor(s)

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