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Proceedings Paper

Automatic Visual Inspection Of Solder Joints On Printed Circuit Boards
Author(s): Yasuo Nakagawa
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Paper Abstract

An automatic visual inspection technique for solder joints on printed circuit boards has been developed. To detect the solder joint shape, structured light is used as the optical system and a simple waveform processing is applied to the extracted shape for judging the shape of a solder joint.

Paper Details

Date Published: 22 November 1982
PDF: 7 pages
Proc. SPIE 0336, Robot Vision, (22 November 1982); doi: 10.1117/12.933619
Show Author Affiliations
Yasuo Nakagawa, Hitachi Ltd. (Japan)

Published in SPIE Proceedings Vol. 0336:
Robot Vision
Azriel Rosenfeld, Editor(s)

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