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Proceedings Paper

EUROSTEP 2000: New Steps In Wafer Steppers
Author(s): Paul Tigreat
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Paper Abstract

EUROSTEP 2000 is a new wafer-stepper oriented towards three increasing requirements coming from integrated circuits manufacturing : throughput : in order to be faster than modified step and repeat cameras, EUROSTEP 2000 uses a stage made of a sandwich of aluminum honeycomb and carbon fiber, at least as stiff as metallic stages but much lighter. This allows high accelerations (0,3 g) and a maximum speed of 200 millimeters/second. Joined to a short exposure time (<150 ms) and a short alignment time, the high stepping speed provides the same throughput as 1 to 1 projection aligners. repeatability : For mix and match requirements, all variations of metrology between two identical or different equipments must be avoided. For positioning, EUROSTEP 2000 uses HOLOGRID, a proprietary X - Y holographic grating interferometry. The holographic grating is a stiff replica of a master standard, with short term and long term repeatability, not affected at all by pressure, humidity, and fast variations of temperature. resolution : EUROSTEP 2000 is oriented towards manufacturing of micron and submicron devices. The present lens is able to print 0.7 micrometer lines and spaces everywhere in the 1 cm2 field. This lens could be replaced by another one, according to wanted field-resolution trade-offs, without any other change in the machine, including the die to reticle automatic alignment device. In order to allow submicrometer printing in 1 cm2 field, die by die autoleveling compensates for wafer defects of flatness, when necessary.

Paper Details

Date Published: 13 September 1982
PDF: 5 pages
Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); doi: 10.1117/12.933564
Show Author Affiliations
Paul Tigreat, EUROMASK (France)

Published in SPIE Proceedings Vol. 0334:
Optical Microlithography I: Technology for the Mid-1980s
Harry L. Stover, Editor(s)

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