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Proceedings Paper

LED package with Dome/side-emitting-enhancement silicone lens achieved by dispensing and geometry transferring
Author(s): Chien-Lin Chang Chien; Yu-Che Huang; Syue-Fong Hu; Chang-Wen Sun; Chung-Min Chang; Chih-Peng Hsu; Ming-Chuen Yip; Weileun Fang
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Paper Abstract

This study presents a structure design and process method for lens type LED package. Dome type or side-emitting-enhancement silicone lens without molding process are achieved. The ceramic ring is adopted as the confine for the encapsulant. The surface intension along the sidewall of ceramic ring and silicone surface, the cohesion force and the gravity of silicone determine the shape of dome type silicone lens. The cone shape tooling coated with a releasing material is immersed into the dome type silicone lens before the silicone fully hardening. After curing simultaneously, to remove the tooling from package, the package with side-emitting-enhancement silicone lens is finished. With the mentioned architecture and process, this LED package herein has three merits, (1) to improve light extraction efficiency: reduce the chance of total internal reflection by the geometry of dome type silicone lens. (2)To enhance the flexibility of LED package design, the die placement location would be constrained by the mold in the traditional package process. (3) Mold-less side-emitting-enhancement silicone lens. Furthermore, two types of cone shape tooling are implemented and compared for side-emitting-enhancement silicone lens. Measurement results show the ratio between the lens high and lens radius could achieve 0.9:1. The view angles of dome type and side-emitting-enhancement LED packaged devices can reach 153° and 180 °, respectively. As using the same brightness grade of LED chip, the luminous flux is increasing 15% as compared the dome type package with the commercial PLCC (Plastic Leaded Chip Carrier) type package. The luminous flux of side-emitting-enhancement LED package decreases 8% as compared with the dome type one.

Paper Details

Date Published: 15 October 2012
PDF: 7 pages
Proc. SPIE 8484, Twelfth International Conference on Solid State Lighting and Fourth International Conference on White LEDs and Solid State Lighting, 84841B (15 October 2012); doi: 10.1117/12.928280
Show Author Affiliations
Chien-Lin Chang Chien, Advanced Optoelectronic Technology Inc. (Taiwan)
National Tsing Hua Univ. (Taiwan)
Yu-Che Huang, National Tsing Hua Univ. (Taiwan)
Syue-Fong Hu, Advanced Optoelectronic Technology Inc. (Taiwan)
Chang-Wen Sun, Advanced Optoelectronic Technology Inc. (Taiwan)
Chung-Min Chang, Advanced Optoelectronic Technology Inc. (Taiwan)
Chih-Peng Hsu, Advanced Optoelectronic Technology Inc. (Taiwan)
Ming-Chuen Yip, Advanced Optoelectronic Technology Inc. (Taiwan)
Weileun Fang, National Tsing Hua Univ. (Taiwan)

Published in SPIE Proceedings Vol. 8484:
Twelfth International Conference on Solid State Lighting and Fourth International Conference on White LEDs and Solid State Lighting
Matthew H. Kane; Christian Wetzel; Jian-Jang Huang; Ian T. Ferguson, Editor(s)

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