
Proceedings Paper
Design and realization of 144 x 7 TDI ROIC with hybrid integrated test structureFormat | Member Price | Non-Member Price |
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Paper Abstract
Design and realization of a 144x7 silicon readout integrated circuit (ROIC) based on switched capacitor TDI for
MCT LWIR scanning type focal plane arrays (FPAs) and its corresponding hybrid integrated test circuits are
presented. TDI operation with 7 detectors improves the SNR of the system by a factor of √7, while oversampling
rate of 3 improves the spatial resolution of the system. ROIC supports bidirectional scan, 5 adjustable gain
settings, bypass operation, automatic gain adjustment in case of mulfunctioning pixels and pixel select/deselect
properties. Integration time of the system can be determined by the help of an external clock. Programming of
ROIC can be done in parallel or serial mode according to the needs of the system. All properties except pixel
select/deselect property can be performed in parallel mode, while pixel select/deselect property can be performed
only in serial mode. ROIC can handle up to 3.75V dynamic range with a load of 25pF and output settling time of
80ns. Input referred noise of the ROIC is less than 750 rms electrons, while the power consumption is less than
100mW. To test ROIC in absence of detector array, a process and temperature compensated current reference
array, which supplies uniform input current in range of 1-50nA to ROIC, is designed and measured both in room
and cryogenic (77ºK) temperatures. Standard deviations of current reference arrays are measured 3.26% for 1nA
and 0.99% for 50nA. ROIC and current reference array are fabricated seperately, and then flip-chip bonded for the
test of the system. Flip-chip bonded system including ROIC and current reference test array is successfully
measured both in room and cryogenic temperatures, and measurement results are presented. The manufacturing
technology is 0.35μm, double poly-Si, four metal, 5V CMOS process.
Paper Details
Date Published: 31 May 2012
PDF: 12 pages
Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 83531Q (31 May 2012); doi: 10.1117/12.920370
Published in SPIE Proceedings Vol. 8353:
Infrared Technology and Applications XXXVIII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)
PDF: 12 pages
Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 83531Q (31 May 2012); doi: 10.1117/12.920370
Show Author Affiliations
Omer Ceylan, Sabanci Univ. (Turkey)
Huseyin Kayahan, Sabanci Univ. (Turkey)
Melik Yazici, Sabanci Univ. (Turkey)
Huseyin Kayahan, Sabanci Univ. (Turkey)
Melik Yazici, Sabanci Univ. (Turkey)
Published in SPIE Proceedings Vol. 8353:
Infrared Technology and Applications XXXVIII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)
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