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Proceedings Paper

Current progress on pixel level packaging for uncooled IRFPA
Author(s): G. Dumont; W. Rabaud; J.-J. Yon; L. Carle; V. Goudon; C. Vialle; Sébastien Becker; Antoine Hamelin; A. Arnaud
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Paper Abstract

Vacuum packaging is definitely a major cost driver for uncooled IRFPA and a technological breakthrough is still expected to comply with the very low cost infrared camera market. To address this key issue, CEA-LETI is developing a Pixel Level Packaging (PLP) technology which basically consists in capping each pixel under vacuum in the direct continuation of the wafer level bolometer process. Previous CEA-LETI works have yet shown the feasibility of PLP based microbolometers that exhibit the required thermal insulation and vacuum achievement. CEA-LETI is still pushing the technology which has been now applied for the first time on a CMOS readout circuit. The paper will report on the recent progress obtained on PLP technology with particular emphasis on the optical efficiency of the PLP arrangement compared to the traditional microbolometer packaging. Results including optical performances, aging studies and compatibility with CMOS readout circuit are extensively presented.

Paper Details

Date Published: 31 May 2012
PDF: 8 pages
Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 83531I (31 May 2012); doi: 10.1117/12.919918
Show Author Affiliations
G. Dumont, CEA-LETI-Minatec (France)
W. Rabaud, CEA-LETI-Minatec (France)
J.-J. Yon, CEA-LETI-Minatec (France)
L. Carle, CEA-LETI-Minatec (France)
V. Goudon, CEA-LETI-Minatec (France)
C. Vialle, CEA-LETI-Minatec (France)
Sébastien Becker, CEA-LETI-Minatec (France)
Antoine Hamelin, CEA-LETI-Minatec (France)
A. Arnaud, CEA-LETI-Minatec (France)

Published in SPIE Proceedings Vol. 8353:
Infrared Technology and Applications XXXVIII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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