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Proceedings Paper

Printed assembly of micro/nanostructured semiconductor materials for high-performance unusual format photovoltaics
Author(s): Jongseung Yoon
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Paper Abstract

Unconventional approaches to exploit established materials in photovoltaics can create novel engineering opportunities, device functionalities, and cost structures, each of which can have significant values in different technological applications. Here, I present an overview of materials and integration strategies that involve a large collection of monocrystalline silicon in micro and nanostructured forms that are derived from wafer-based source materials. Printinglike assembly techniques offered a practical means to manipulate ultrathin, micro/nanoscale building blocks in a massively parallel, cost-effective manner, thereby enabling device- and module-level integration on various classes of foreign substrates with advantages in areal coverages, formats, and costs that have been difficult in conventional crystalline silicon photovoltaics.

Paper Details

Date Published: 7 May 2012
PDF: 5 pages
Proc. SPIE 8373, Micro- and Nanotechnology Sensors, Systems, and Applications IV, 83731E (7 May 2012); doi: 10.1117/12.919646
Show Author Affiliations
Jongseung Yoon, The Univ. of Southern California (United States)

Published in SPIE Proceedings Vol. 8373:
Micro- and Nanotechnology Sensors, Systems, and Applications IV
Thomas George; M. Saif Islam; Achyut Dutta, Editor(s)

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