
Proceedings Paper
100mm GaSb substrate manufacturing for IRFPA epi growthFormat | Member Price | Non-Member Price |
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Paper Abstract
Mega-pixel FPAs in both MWIR and LWIR spectral bands based on Sb strained layer superlattices and nBn epitaxial
structures grown on GaSb substrates have recently demonstrated impressive performances at high operating
temperatures. An essential component of SLS epitaxial growth initiation is the starting wafer flatness, smoothness and
haze. Large diameter GaSb wafers must be manufactured meeting these stringent demands and current state-of-the-art
GaSb substrate manufacturing is focused on 100mm wafer diameters. Using a newly developed polishing process,
100mm GaSb substrate manufacturing has resulted in consistent starting wafer peak-to-valley flatness well below 5μm
and surface roughness below Rms of 0.2nm. Final substrate and epitaxial wafer Surfscan mapping (<1000/cm2 surface
defects) and surface roughness (Rms~0.2nm) are presented and compared with measurements of the starting substrates.
This paper evaluates the manufacturing and epitaxial growth on 100mm GaSb substrates that have been processed to
achieve an MBE grown InAsSb-based nBn MWIR photodetector structure.
Paper Details
Date Published: 31 May 2012
PDF: 6 pages
Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 835313 (31 May 2012); doi: 10.1117/12.919287
Published in SPIE Proceedings Vol. 8353:
Infrared Technology and Applications XXXVIII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)
PDF: 6 pages
Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 835313 (31 May 2012); doi: 10.1117/12.919287
Show Author Affiliations
Lisa P. Allen, Galaxy Compound Semiconductors, Inc. (United States)
J. Patrick Flint, Galaxy Compound Semiconductors, Inc. (United States)
Greg Meshew, Galaxy Compound Semiconductors, Inc. (United States)
Gordon Dallas, Galaxy Compound Semiconductors, Inc. (United States)
John Trevethan, Galaxy Compound Semiconductors, Inc. (United States)
J. Patrick Flint, Galaxy Compound Semiconductors, Inc. (United States)
Greg Meshew, Galaxy Compound Semiconductors, Inc. (United States)
Gordon Dallas, Galaxy Compound Semiconductors, Inc. (United States)
John Trevethan, Galaxy Compound Semiconductors, Inc. (United States)
Dmitri Lubyshev, IQE, Inc. (United States)
Yueming Qiu, IQE, Inc. (United States)
Joel M. Fastenau, IQE, Inc. (United States)
Amy W. K. Liu, IQE, Inc. (United States)
Yueming Qiu, IQE, Inc. (United States)
Joel M. Fastenau, IQE, Inc. (United States)
Amy W. K. Liu, IQE, Inc. (United States)
Published in SPIE Proceedings Vol. 8353:
Infrared Technology and Applications XXXVIII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)
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