Share Email Print
cover

Proceedings Paper

Characterization and decomposition of self-aligned quadruple patterning friendly layout
Author(s): Hongbo Zhang; Yuelin Du; Martin D. F. Wong; Rasit O. Topaloglu
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Self-aligned quadruple patterning (SAQP) lithography is one of the major techniques for the future process requirement after 16nm/14nm technology node. In this paper, based on the existing knowledge of current 193nm lithography and process flow of SAQP, we will process an early study on the definition of SAQP-friendly layout. With the exploration of the feasible feature regions and possible combinations of adjacent features, we will define several simple but important geometry rules to help define the SAQP-friendliness. Then, we will introduce a conflicting graph algorithm to generate the feature region assignment for SAQP decomposition. Our experimental results validate our SAQP-friendly layout definition, and basic circuit building blocks in the low level metal layer are analyzed.

Paper Details

Date Published: 13 March 2012
PDF: 11 pages
Proc. SPIE 8326, Optical Microlithography XXV, 83260F (13 March 2012); doi: 10.1117/12.918078
Show Author Affiliations
Hongbo Zhang, Univ. of Illinois at Urbana-Champaign (United States)
Yuelin Du, Univ. of Illinois at Urbana-Champaign (United States)
Martin D. F. Wong, Univ. of Illinois at Urbana-Champaign (United States)
Rasit O. Topaloglu, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 8326:
Optical Microlithography XXV
Will Conley, Editor(s)

© SPIE. Terms of Use
Back to Top