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Hybrid metrology solution for 1X-node technology
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Paper Abstract

The accelerated pace of the semiconductor industry in recent years is putting a strain on existing dimensional metrology equipments (such as CDSEM, AFM, Scatterometry) to keep up with ever-increasing metrology challenges. However, a revolution appears to be forming with the recent advent of Hybrid Metrology (HM) - a practice of combining measurements from multiple equipment types in order to enable or improve measurement performance. In this paper we extend our previous work on HM to measure advanced 1X node layers - EUV and Negative Tone Develop (NTD) resist as well as 3D etch structures such as FinFETs. We study the issue of data quality and matching between toolsets involved in hybridization, and propose a unique optimization methodology to overcome these effects. We demonstrate measurement improvement for these advanced structures using HM by verifying the data with reference tools (AFM, XSEM, TEM). We also study enhanced OCD models for litho structures by modeling Line-edge roughness (LER) and validate its impact on profile accuracy. Finally, we investigate hybrid calibration of CDSEM to measure in-die resist line height by Pattern Top Roughness (PTR) methodology.

Paper Details

Date Published: 4 April 2012
PDF: 22 pages
Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 832404 (4 April 2012);
Show Author Affiliations
Alok Vaid, GLOBALFOUNDRIES (United States)
Alexander Elia, GLOBALFOUNDRIES (United States)
Mark Kelling, GLOBALFOUNDRIES (United States)
John Allgair, GLOBALFOUNDRIES (United States)
Carsten Hartig, GLOBALFOUNDRIES (Germany)
Peter Ebersbach, GLOBALFOUNDRIES (Germany)
Erin McLellan, IBM Corp. (United States)
Matthew Sendelbach, IBM Corp. (United States)
Nedal Saleh, IBM Corp. (United States)
Narender Rana, IBM Corp. (United States)
Hiroki Kawada, Hitachi High-Technologies Corp. (Japan)
Toru Ikegami, Hitachi High-Technologies Corp. (Japan)
Masahiko Ikeno, Hitachi High-Technologies Corp. (Japan)
Takahiro Kawasaki, Hitachi High-Technologies Corp. (Japan)
Cornel Bozdog, Nova Measuring Instruments, Inc. (United States)
Helen Kim, Nova Measuring Instruments, Inc. (United States)
Elad Arnon, Nova Measuring Instruments, Ltd. (Israel)
Roy Koret, Nova Measuring Instruments, Ltd. (Israel)
Igor Turovets, Nova Measuring Instruments, Ltd. (Israel)

Published in SPIE Proceedings Vol. 8324:
Metrology, Inspection, and Process Control for Microlithography XXVI
Alexander Starikov, Editor(s)

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