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Proceedings Paper

Source mask optimization methodology (SMO) and application to real full chip optical proximity correction
Author(s): DongQing Zhang; GekSoon Chua; YeeMei Foong; Yi Zou; Stephen Hsu; Stanislas Baron; Mu Feng; Hua-Yu Liu; Zhipan Li; Jessy Schramm; T. Yun; Carl Babcock; Byoung IL Choi; Stefan Roling; Alessandra Navarra; Tanja Fischer; Andre Leschok; Xiaofeng Liu; Weijie Shi; Jianhong Qiu; Russell Dover
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Paper Abstract

Due to the continuous shrinking in half pitch and critical dimension (CD) in wafer processing, maintaining a reasonable process window such as depth of focus (DOF) & exposure latitude (EL) becomes very challenging. With the source mask optimization (SMO) methodology, the lithography process window can be improved and a smaller mask error enhancement factor (MEEF) can be achieved. In this paper, the Tachyon SMO work flow and methodology was evaluated. The optimum source was achieved through evaluation of the critical designs with Tachyon SMO software and the simulated performance was then verified on another test case. Criteria such as DOF, EL & MEEF were used to determine the optimum source achieved from the evaluation. Furthermore, the process variation band (PV-Band) and the number of hot spot (design weak points) were compared between the POR and the optimum source. The simulation result shows the DOF, MEEF & worst PV-Band were improved by 13%, 17% & 12%, respectively with the optimum SMO source. In order to verify the improvement from the optimum SMO at the silicon level, a new OPC model was recalibrated with wafer CD from the optimized source. The OPC recipe was also optimized and a reticle was retrofitted with the new OPC. By comparing the process window, hotspots and defects between the original vs. new reticle, the benefit of the optimized source was verified on silicon.

Paper Details

Date Published: 13 March 2012
PDF: 11 pages
Proc. SPIE 8326, Optical Microlithography XXV, 83261V (13 March 2012); doi: 10.1117/12.916614
Show Author Affiliations
DongQing Zhang, GLOBALFOUNDRIES Inc. (Singapore)
GekSoon Chua, GLOBALFOUNDRIES Inc. (Singapore)
YeeMei Foong, GLOBALFOUNDRIES Inc. (Singapore)
Yi Zou, GLOBALFOUNDRIES Inc. (Singapore)
Stephen Hsu, Brion Technologies, Inc. (United States)
Stanislas Baron, Brion Technologies, Inc. (United States)
Mu Feng, Brion Technologies, Inc. (United States)
Hua-Yu Liu, Brion Technologies, Inc. (United States)
Zhipan Li, Brion Technologies, Inc. (United States)
Jessy Schramm, GLOBALFOUNDRIES Inc. (Singapore)
T. Yun, GLOBALFOUNDRIES Inc. (Singapore)
Carl Babcock, GLOBALFOUNDRIES Inc. (Singapore)
Byoung IL Choi, GLOBALFOUNDRIES Inc. (Singapore)
Stefan Roling, GLOBALFOUNDRIES Inc. (Singapore)
Alessandra Navarra, GLOBALFOUNDRIES Inc. (Singapore)
Tanja Fischer, GLOBALFOUNDRIES Inc. (Singapore)
Andre Leschok, GLOBALFOUNDRIES Inc. (Singapore)
Xiaofeng Liu, Brion Technologies, Inc. (United States)
Weijie Shi, Brion Technologies, Inc. (United States)
Jianhong Qiu, Brion Technologies, Inc. (United States)
Russell Dover, Brion Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 8326:
Optical Microlithography XXV
Will Conley, Editor(s)

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