Share Email Print

Proceedings Paper

Immersion and dry ArF scanners enabling 22nm HP production and beyond
Author(s): Yusaku Uehara; Jun Ishikawa; Hirotaka Kohno; Eiichiro Tanaka; Masanori Ohba; Yuichi Shibazaki
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Pattern shrinks using multiple patterning techniques will continue to the 22nm half pitch (HP) node and beyond. The cutting-edge Nikon NSR-S621D immersion lithography tool, which builds upon the technology advancements of the NSR-S620D [1], was developed to satisfy the aggressive requirements for the 22 nm HP node and subsequent generations. The key design challenge for the S621D was to deliver further improvements to product overlay performance and CD uniformity, while also providing increased productivity. Since many different products are made within an IC manufacturing facility, various wafer process-related issues, including the flatness or grid distortion of the processed wafers and exposure-induced heating had to be addressed. Upgrades and enhancements were made to the S620D hardware and software systems to enable the S621D to minimize these process-related effects and deliver the necessary scanner performance. To enable continued process technology advancements, in addition to pattern shrinks at the most critical layers, resolution for less critical layers must also be improved proportionally. As a result, increased demand for dry ArF instead of KrF scanners is expected for less critical layers, and dry ArF tools are already being employed for some of these applications. Further, multiple patterning techniques, such as sidewall double patterning, actually enable use of dry ArF instead of immersion scanners for some critical layers having relaxed pattern resolution requirements. However, in order for this to be successful, the ArF dry tool must deliver overlay performance that is comparable to the latest generation immersion systems. Understanding these factors, an ArF dry scanner that has excellent overlay performance could be used effectively for critical layers and markedly improve cost of ownership (CoO). Therefore, Nikon has developed the NSR-S320F, a new dry ArF scanner also built upon the proven S620D Streamlign platform. By incorporating the Streamlign innovations, sufficient overlay accuracy for critical layers, as well as maximized productivity can be achieved. Furthermore, CoO will be significantly improved, which is the vital benefit when comparing ArF dry vs. immersion scanners. In this paper / presentation the latest S621D and S320F performance data will be introduced.

Paper Details

Date Published: 13 March 2012
PDF: 12 pages
Proc. SPIE 8326, Optical Microlithography XXV, 83261H (13 March 2012); doi: 10.1117/12.916247
Show Author Affiliations
Yusaku Uehara, Nikon Corp. (Japan)
Jun Ishikawa, Nikon Corp. (Japan)
Hirotaka Kohno, Nikon Corp. (Japan)
Eiichiro Tanaka, Nikon Corp. (Japan)
Masanori Ohba, Nikon Corp. (Japan)
Yuichi Shibazaki, Nikon Corp. (Japan)

Published in SPIE Proceedings Vol. 8326:
Optical Microlithography XXV
Will Conley, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?