
Proceedings Paper
Dense vibration measurement of an arch bridge before and after its seismic retrofit using wireless smart sensorsFormat | Member Price | Non-Member Price |
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Paper Abstract
Fundamental functionalities of wireless smart sensors to measure full-scale bridge vibration, such as time
synchronization, loss-less multihop communication, and capability to capture small ambient vibrations, are maturing;
dense vibration measurement of large structures using wireless smart sensors is expected to reveal the detailed condition
of existing structures. An arch bridge is chosen as a target bridge and densely instrumented by 48 wireless smart sensors.
Traffic induced vibration of the bridge has been measured before and after its seismic retrofit. The differences between
the measured dynamic characteristics are considered to represent the effects of seismic retrofit. The dense measurement
allows comparison of spatial characteristics such as detailed mode shapes, in addition to comparison of natural
frequencies. Comparison of densely measured mode shapes reveals their changes, which are then used to update the
finite element model of the bridge. The measurement, data analysis, and model updating indicate a potential use of dense
instrumentation of wireless smart sensor network for structural condition assessment.
Paper Details
Date Published: 6 April 2012
PDF: 7 pages
Proc. SPIE 8345, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012, 834536 (6 April 2012); doi: 10.1117/12.915704
Published in SPIE Proceedings Vol. 8345:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012
Masayoshi Tomizuka; Chung-Bang Yun; Jerome P. Lynch, Editor(s)
PDF: 7 pages
Proc. SPIE 8345, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012, 834536 (6 April 2012); doi: 10.1117/12.915704
Show Author Affiliations
Tomonori Nagayama, The Univ. of Tokyo (Japan)
Akihiko Urushima, Taisei Corp. (Japan)
Yozo Fujino, The Univ. of Tokyo (Japan)
Akihiko Urushima, Taisei Corp. (Japan)
Yozo Fujino, The Univ. of Tokyo (Japan)
Takeshi Miyashita, Nagaoka Univ. of Technology (Japan)
Tsutomu Yoshioka, Nippon Engineering Consultants Co. Ltd. (Japan)
Masataka Ieiri, JIP Techno Science Corp. (Japan)
Tsutomu Yoshioka, Nippon Engineering Consultants Co. Ltd. (Japan)
Masataka Ieiri, JIP Techno Science Corp. (Japan)
Published in SPIE Proceedings Vol. 8345:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012
Masayoshi Tomizuka; Chung-Bang Yun; Jerome P. Lynch, Editor(s)
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