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Proceedings Paper

Gray-level 3D resist process and its application
Author(s): Yung-Chiang Ting; Shyi-Long Shy; Andy Liu; Cheng-San Wu; C. C. Chen
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Paper Abstract

Gray level 3D resist process were developed by using negative e-beam resist and multiple coating multiple electron beam wafer direct write alignment, and are now going into be used to create complex 3D structures in thick resist. Gray level resist process to create 3D structure in thick resist can be used as mold for manufacturing Fly's-eye lens array, Fresnel lens, Prism, Flat prism and Light guiding plate. Such optical devices can be used for TFT LCD display, solar concentrator and LED.

Paper Details

Date Published: 19 March 2012
PDF: 9 pages
Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83252E (19 March 2012); doi: 10.1117/12.915702
Show Author Affiliations
Yung-Chiang Ting, Far East Univ. (Taiwan)
Shyi-Long Shy, National Nano Device Labs. (Taiwan)
Andy Liu, National Nano Device Labs. (Taiwan)
Cheng-San Wu, National Nano Device Labs. (Taiwan)
C. C. Chen, National Nano Device Labs. (Taiwan)

Published in SPIE Proceedings Vol. 8325:
Advances in Resist Materials and Processing Technology XXIX
Mark H. Somervell; Thomas I. Wallow, Editor(s)

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