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Proceedings Paper

Chip-scale demonstration of 3D integrated intrachip free-space optical interconnect
Author(s): Hui Wu; Berkehan Ciftcioglu; Rebecca Berman; Jiyanhun Hu; Shang Wang; Ioannis Savidis; Manish Jain; Duncan Moore; Michael Huang; Eby G. Friedman; Gary Wicks
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Paper Abstract

This paper presents the first chip-scale demonstration of an intra-chip free-space optical interconnect (FSOI) we recently proposed. This interconnect system uses point-to-point free-space optical links to construct an all-to-all intra-chip communication network. Unlike other electrical and waveguide-based optical interconnect systems, FSOI exhibits low latency, high energy efficiency, and large bandwidth density with little degradation for long distance transmission, and hence can significantly improve the performance of future many-core chips. A 1x1-cm2 chip prototype is fabricated on a germanium substrate with integrated photodetectors. A commercial 850-nm GaAs vertical-cavity-surface-emitting-laser (VCSEL) and fabricated fused silica micro-lenses are 3-D integrated on top of the germanium substrate. At a 1.4-cm distance, the measured optical transmission loss is 5 dB and crosstalk is less than -20 dB. The electrical-to-electrical bandwidth is 3.3 GHz, limited by the VCSEL.

Paper Details

Date Published: 2 February 2012
PDF: 10 pages
Proc. SPIE 8265, Optoelectronic Integrated Circuits XIV, 82650C (2 February 2012); doi: 10.1117/12.913314
Show Author Affiliations
Hui Wu, Univ. of Rochester (United States)
Berkehan Ciftcioglu, Univ. of Rochester (United States)
Rebecca Berman, Institute of Optics, Univ. of Rochester (United States)
Jiyanhun Hu, Univ. of Rochester (United States)
Shang Wang, Univ. of Rochester (United States)
Ioannis Savidis, Univ. of Rochester (United States)
Manish Jain, Institute of Optics, Univ. of Rochester (United States)
Duncan Moore, Institute of Optics, Univ. of Rochester (United States)
Michael Huang, Univ. of Rochester (United States)
Eby G. Friedman, Univ. of Rochester (United States)
Gary Wicks, Institute of Optics, Univ. of Rochester (United States)

Published in SPIE Proceedings Vol. 8265:
Optoelectronic Integrated Circuits XIV
Louay A. Eldada; El-Hang Lee, Editor(s)

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