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Proceedings Paper

Peeling stress analysis of piezo-bonded laminated composite plate
Author(s): Bin Huang; Heung Soo Kim
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Paper Abstract

A stress function based method is proposed to analyze the interlaminar stresses at the free edge of a piezo-bonded composite laminated structure. Two piezoelectric actuators are symmetrically surface bonded on composite laminate. Same electric fields are applied to the two symmetric piezoelectric actuators which can generate induced strain, resulting in pure extension on the laminated plate. The stresses that satisfy the traction-free boundary conditions at the free edge and at the top and bottom surfaces of the laminate were obtained by using the complementary virtual work principle. Cross-ply and angle-ply laminates were analyzed. To verify the proposed method, the stress concentrations predicted by the present method were compared with those analyzed by the finite element method. The results provided that the stress function based analysis of piezo-bonded laminated composite structure is an efficient and accurate method for initial design stage of piezo-composite structure.

Paper Details

Date Published: 27 March 2012
PDF: 7 pages
Proc. SPIE 8341, Active and Passive Smart Structures and Integrated Systems 2012, 834129 (27 March 2012); doi: 10.1117/12.913018
Show Author Affiliations
Bin Huang, Dongguk Univ. (Korea, Republic of)
Heung Soo Kim, Dongguk Univ. (Korea, Republic of)

Published in SPIE Proceedings Vol. 8341:
Active and Passive Smart Structures and Integrated Systems 2012
Henry A. Sodano, Editor(s)

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