We present techniques for modeling the physics and systems-level characteristics of integrated IQ-transmitters for 100G+ applications and emphasize important design aspects. Using time-and-frequency-domain modeling (TFDM) of Photonic Integrated Circuits (PIC), we present a detailed IQ-transmitter model based on the physics and setup of active and passive subcomponents. With this, we link characteristics of subcomponents (bending loss of waveguides, phase changes in MMI couplers, sweep-out time of EAMs) to systems-level characteristics of the integrated IQ-transmitter (extinction ratio, modulation bandwidth, chirp). Further, a behavioral transmitter model is introduced and utilized to assess electrical driving requirements (allowed jitter, noise, synchronization offset).

Date Published: 24 January 2012
PDF: 8 pages
Proc. SPIE 8284, Next-Generation Optical Communication: Components, Sub-Systems, and Systems, 82840L (24 January 2012); doi: 10.1117/12.912096

Published in SPIE Proceedings Vol. 8284:
Next-Generation Optical Communication: Components, Sub-Systems, and Systems
Guifang Li; Dieter Stefan Jäger, Editor(s)