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Proceedings Paper

Transmitting part of optical interconnect module with three-dimensional optical path
Author(s): Chia-Chi Chang; Po-Kuan Shen; Chin-Ta Chen; Hsu-Liang Hsiao; Yen-Chung Chang; Yun-Chih Lee; Mount-Learn Wu
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Paper Abstract

Transmitting part of optical interconnection module with three-dimensional optical path is demonstrated. In this module, electronic-device and photonic-device are separated on the front and rear sides of SOI substrate. The key component of this module are 45° micro reflector and trapezoidal waveguide which are fabricated by single-step wet etching on front side of SOI substrate. High-frequency transmission lines for 4-channel × 2.5-GHz and VCSELs are constructed on rear side of SOI substrate. In this module, the measurement result of optical coupling efficiency is -8.09 dB, and the 1-dB alignment tolerances are 25 μm and 26 μm on the horizontal and vertical direction, respectively. Eye diagrams are measured at data rate of 1-Gbps and 2.5-Gbps with the 215-1 PRBS pattern and the clearly open eyes are demonstrated.

Paper Details

Date Published: 2 February 2012
PDF: 8 pages
Proc. SPIE 8267, Optoelectronic Interconnects XII, 82671A (2 February 2012); doi: 10.1117/12.909759
Show Author Affiliations
Chia-Chi Chang, National Central Univ. (Taiwan)
Po-Kuan Shen, National Central Univ. (Taiwan)
Chin-Ta Chen, National Central Univ. (Taiwan)
Hsu-Liang Hsiao, National Central Univ. (Taiwan)
Yen-Chung Chang, National Central Univ. (Taiwan)
Yun-Chih Lee, Centera Photonics Inc. (Taiwan)
Mount-Learn Wu, National Central Univ. (Taiwan)

Published in SPIE Proceedings Vol. 8267:
Optoelectronic Interconnects XII
Alexei L. Glebov; Ray T. Chen, Editor(s)

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