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Proceedings Paper

A thin porous substrate using bonded particles for reverse-emulsion electrophoretic displays
Author(s): M. Ahumada; M. Bryning; R. Cromer; M. Hartono; S. J. Lee
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Paper Abstract

A thin porous layer of bonded ceramic microparticles has been developed to provide structural integrity and a stationary matrix for use in reflective-mode reverse-emulsion electrophoretic displays (REED), based on self-assembled nanodroplets dispersed in a non-polar liquid. REED ink uses low-cost materials and manufacturing processes, yet is capable of video speed and low voltage operation below 10 V. Porous layers of titanium dioxide (TiO2) are prepared as thin as 10 microns by fluidizing the particles in a water-based slurry with polymeric adhesive. The slurry is distributed between glass shear plates, one of which serves as the substrate for the working device. Particle morphology is examined using scanning electron microscopy and layer uniformity is characterized by opacity measurements using a throughbeam fiber optic sensor. Performance of the bonded matrix with REED ink is compared to baseline performance of a paste mixture, comprised of the same ink and unbonded TiO2 particles. Results show that at 25% volume fraction, the bonded substrate improves image bistability and is better able to maintain both light and dark intensity after extensive switching. The same bonded substrate also improves image bistability when power is disconnected, even compared to a paste with 40% volume fraction of TiO2.

Paper Details

Date Published: 6 February 2012
PDF: 8 pages
Proc. SPIE 8280, Advances in Display Technologies II, 82800R (6 February 2012); doi: 10.1117/12.909252
Show Author Affiliations
M. Ahumada, San Jose State Univ. (United States)
M. Bryning, Zikon, Inc. (United States)
R. Cromer, Zikon, Inc. (United States)
M. Hartono, San Jose State Univ. (United States)
S. J. Lee, San Jose State Univ. (United States)

Published in SPIE Proceedings Vol. 8280:
Advances in Display Technologies II
Liang-Chy Chien; Sin-Doo Lee; Ming Hsien Wu, Editor(s)

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