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Proceedings Paper

Laser origami: a new technique for assembling 3D microstructures
Author(s): Alberto Piqué; Scott A. Mathews; Nicholas A. Charipar; Andrew J. Birnbaum
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Paper Abstract

The ability to manufacture and assemble complex three-dimensional (3D) systems via traditional photolithographic techniques has attracted increasing attention. However, most of the work to date still utilizes the traditional patterning and etching processes designed for the semiconductor industry where 2D structures are first fabricated, followed by some alternative technique for releasing these structures out-of-plane. Here we present a novel technique called Laser Origami, which has demonstrated the ability to generate 3D microstructures through the controlled out-of-plane folding of 2D patterns. This non-lithographic, and non silicon-based process is capable of microfabricating 3D structures of arbitrary shape and geometric complexity on a variety of substrates. The Laser Origami technique allows for the design and fabrication of arrays of 3D microstructures, where each microstructure can be made to fold independently of the others. Application of these folded micro-assemblies might make possible the development of highly complex and interconnected electrical, optical and mechanical 3D systems. This article will describe the unique advantages and capabilities of Laser Origami, discuss its applications and explore its role for the assembly and generation of 3D microstructures.

Paper Details

Date Published: 4 February 2012
PDF: 7 pages
Proc. SPIE 8244, Laser-based Micro- and Nanopackaging and Assembly VI, 82440B (4 February 2012); doi: 10.1117/12.909187
Show Author Affiliations
Alberto Piqué, U.S. Naval Research Lab. (United States)
Scott A. Mathews, U.S. Naval Research Lab. (United States)
Nicholas A. Charipar, U.S. Naval Research Lab. (United States)
Andrew J. Birnbaum, U.S. Naval Research Lab. (United States)

Published in SPIE Proceedings Vol. 8244:
Laser-based Micro- and Nanopackaging and Assembly VI
Friedrich G. Bachmann; Wilhelm Pfleging; Kunihiko Washio; Jun Amako; Willem Hoving; Yongfeng Lu, Editor(s)

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