New laser processing strategies in micro processing of glass, quartz and other optically transparent materials are being developed with increasing effort. Utilizing diode-pumped solid-state laser generating nanosecond pulsed green (532 nm) laser light in conjunction with either scanners or special trepanning systems can provide for reliable glass machining at excellent efficiency. Micro ablation can be induced either from the front or rear side of the glass sample. Ablation rates of over 100 μm per pulse can be achieved in rear side processing. In comparison, picosecond laser processing of glass and quartz (at a wavelength of 1064 or 532 nm) yield smaller feed rates at however much better surface and bore wall quality. This is of great importance for small sized features, e.g. through-hole diameters smaller 50 μm in thin glass. Critical for applications with minimum micro cracks and maximum performance is an appropriate distribution of laser pulses over the work piece along with optimum laser parameters. Laser machining tasks are long aspect micro drilling, slanted through holes, internal contour cuts, micro pockets and more complex geometries in e.g. soda-lime glass, B33, B270, D236T, AF45 and BK7 glass, quartz, and Zerodur.

Date Published: 15 February 2012
PDF: 7 pages
Proc. SPIE 8243, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVII, 82430M (15 February 2012); doi: 10.1117/12.907740

Published in SPIE Proceedings Vol. 8243:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVII
Guido Hennig; Xianfan Xu; Bo Gu; Yoshiki Nakata, Editor(s)