
Proceedings Paper
Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on SiFormat | Member Price | Non-Member Price |
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Paper Abstract
We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical
dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will
make the use of wire bonding redundant and will allow for impedance matched metallic wiring between the electronic
driving circuit and its opto-electronic counter part. We suggest the use of a thick photoresist ramp between CMOS driver
and opto-electrical dies surface as the bridge for supporting co-plannar waveguides (CPW) electrically plated with
lithographic accuracy. In this way all three dimensions of the interconnecting metal layer, width, length and thickness
can be completely controlled. In this 1st demonstration all processing is done on commercially available devices and
products, and is compatible with CMOS processing technology.
To test the applicability of CPW instead of wire bonds for interconnecting the CMOS circuit and opto-electronic chips,
we have made test samples and tested their performance at speeds up to 10 Gbps. In this demonstration, a silicon
substrate was used on which we evaporated gold co-planar waveguides (CPW) to mimic a wire on the driver. An optical
link consisting of a VCSEL chip and a photodiode chip has been assembled and fully characterized using optical
coupling into and out of a multimode fiber (MMF). A 10 Gb/s 27-1 NRZ PRBS signal transmitted from one chip to
another chip was detected error free. A 4 dB receiver sensitivity penalty is measured for the integrated device compared
to a commercial link.
Paper Details
Date Published: 2 February 2012
PDF: 6 pages
Proc. SPIE 8267, Optoelectronic Interconnects XII, 82670U (2 February 2012); doi: 10.1117/12.906373
Published in SPIE Proceedings Vol. 8267:
Optoelectronic Interconnects XII
Alexei L. Glebov; Ray T. Chen, Editor(s)
PDF: 6 pages
Proc. SPIE 8267, Optoelectronic Interconnects XII, 82670U (2 February 2012); doi: 10.1117/12.906373
Show Author Affiliations
P. Duan, Technische Univ. Eindhoven (Netherlands)
O. Raz, Technische Univ. Eindhoven (Netherlands)
B. E. Smalbrugge, Technische Univ. Eindhoven (Netherlands)
O. Raz, Technische Univ. Eindhoven (Netherlands)
B. E. Smalbrugge, Technische Univ. Eindhoven (Netherlands)
J. Duis, TE Connectivity Ltd. (Netherlands)
H. J. S. Dorren, Technische Univ. Eindhoven (Netherlands)
H. J. S. Dorren, Technische Univ. Eindhoven (Netherlands)
Published in SPIE Proceedings Vol. 8267:
Optoelectronic Interconnects XII
Alexei L. Glebov; Ray T. Chen, Editor(s)
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