
Proceedings Paper
The impact of active layer design on quantum efficiency of InGaN light emitting diodesFormat | Member Price | Non-Member Price |
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Paper Abstract
The effect of active layer design on the efficiency of InGaN light emitting diodes (LEDs) with the light emission in blue
(~420 nm) has been studied. Correlation between the internal quantum efficiency (IQE) and relative external quantum
efficiency (EQE) and salient features of structures on c-plane InGaN LEDs which contain multiple quantum wells
(MQWs) of different barrier height (either In0.01Ga0.99N or In0.06Ga0.94N barriers) and thickness (3 nm and 12 nm) as well
as different double heterostructure (DH) designs (3 nm, dual 3 nm, 6 nm, dual 6 nm, 9 nm and 11 nm) with inserted 3
nm In0.06Ga0.94N barrier. Pulsed electroluminescence (EL) and optical excitation power-dependent photoluminescence
(PL) measurements indicated that the thinner and lower In0.06Ga0.94N barriers bode well for high EQE and IQE.
Furthermore, increase of the effective active region thickness by multiple InGaN DH structures (dual, quad and hex)
separated by 3 nm In0.06Ga0.94N barriers is promising at high injection levels. Although increasing the single DH
thickness from 3 to 6 nm improves the peak relative EQE by nearly 3.6 times due to increased density of states and
increased emitting volume, the IQE suffers a nearly 30% loss. Further increase in the DH thickness to 9 and 11 nm
results in a significantly slower rate of increase of EQE with current injection and lower peak EQE values presumably
due to degradation of the InGaN layer. Increasing the number of 3 nm DH active regions with 3 nm In0.06Ga0.94N
barriers improves EQE, while still maintaining high IQE (above 95% at a carrier concentration of 1018 cm-3) and
showing negligible EQE degradation up to 550 A/cm2 due to increased emitting volume and high radiative
recombination coefficients and high IQE.
Paper Details
Date Published: 9 February 2012
PDF: 8 pages
Proc. SPIE 8262, Gallium Nitride Materials and Devices VII, 82621G (9 February 2012); doi: 10.1117/12.903931
Published in SPIE Proceedings Vol. 8262:
Gallium Nitride Materials and Devices VII
Jen-Inn Chyi; Yasushi Nanishi; Hadis Morkoç; Joachim Piprek; Euijoon Yoon, Editor(s)
PDF: 8 pages
Proc. SPIE 8262, Gallium Nitride Materials and Devices VII, 82621G (9 February 2012); doi: 10.1117/12.903931
Show Author Affiliations
F. Zhang, Virginia Commonwealth Univ. (United States)
X. Li, Virginia Commonwealth Univ. (United States)
S. Okur, Virginia Commonwealth Univ. (United States)
V. Avrutin, Virginia Commonwealth Univ. (United States)
Ü. Özgür, Virginia Commonwealth Univ. (United States)
X. Li, Virginia Commonwealth Univ. (United States)
S. Okur, Virginia Commonwealth Univ. (United States)
V. Avrutin, Virginia Commonwealth Univ. (United States)
Ü. Özgür, Virginia Commonwealth Univ. (United States)
H. Morkoç, Virginia Commonwealth Univ. (United States)
S. M. Hong, Epistar Corp. (Taiwan)
S. H. Yen, Epistar Corp. (Taiwan)
T. S. Hsu, Epistar Corp. (Taiwan)
A. Matulionis, Semiconductor Physics Institute of Ctr. for Physical Science and Technology (Lithuania)
S. M. Hong, Epistar Corp. (Taiwan)
S. H. Yen, Epistar Corp. (Taiwan)
T. S. Hsu, Epistar Corp. (Taiwan)
A. Matulionis, Semiconductor Physics Institute of Ctr. for Physical Science and Technology (Lithuania)
Published in SPIE Proceedings Vol. 8262:
Gallium Nitride Materials and Devices VII
Jen-Inn Chyi; Yasushi Nanishi; Hadis Morkoç; Joachim Piprek; Euijoon Yoon, Editor(s)
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