
Proceedings Paper
Electromagnetic inhibition of high frequency thermal bonding machineFormat | Member Price | Non-Member Price |
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Paper Abstract
The traditional high frequency thermal bonding machine had serious radiation problems at dominant frequency, two
times frequency and three times frequency. Combining with its working principle, the problems of electromagnetic
compatibility were studied, three following measures were adopted: 1.At the head part of the high frequency thermal
bonding machine, resonant circuit attenuator was designed. The notch groove and reaction field can make the radiation
being undermined or absorbed; 2.The electromagnetic radiation shielding was made for the high frequency copper power
feeder; 3.Redesigned the high-frequency oscillator circuit to reduce the output of harmonic oscillator. The test results
showed that these measures can make the output according with the national standard of electromagnetic compatibility
(GB4824-2004-2A), the problems of electromagnetic radiation leakage can be solved, and good social, environmental
and economic benefits would be brought.
Paper Details
Date Published: 15 November 2011
PDF: 7 pages
Proc. SPIE 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 83210B (15 November 2011); doi: 10.1117/12.903667
Published in SPIE Proceedings Vol. 8321:
Seventh International Symposium on Precision Engineering Measurements and Instrumentation
Kuang-Chao Fan; Man Song; Rong-Sheng Lu, Editor(s)
PDF: 7 pages
Proc. SPIE 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 83210B (15 November 2011); doi: 10.1117/12.903667
Show Author Affiliations
Hong He, Tianjin Univ. of Technology (China)
Qing-qing Zhang, Tianjin Univ. of Technology (China)
Hang Li, Dept. Tianjin Cancer Hospital Equipment (China)
Qing-qing Zhang, Tianjin Univ. of Technology (China)
Hang Li, Dept. Tianjin Cancer Hospital Equipment (China)
Da-jian Zhang, Research Institute of Measure Technology (China)
Ming-feng Hou, Research Institute of Measure Technology (China)
Xian-wei Zhu, Tianjin Univ. of Technology (China)
Ming-feng Hou, Research Institute of Measure Technology (China)
Xian-wei Zhu, Tianjin Univ. of Technology (China)
Published in SPIE Proceedings Vol. 8321:
Seventh International Symposium on Precision Engineering Measurements and Instrumentation
Kuang-Chao Fan; Man Song; Rong-Sheng Lu, Editor(s)
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