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Proceedings Paper

Systematic approach for tolerance analysis of photonic systems
Author(s): J. F. C. van Gurp; M. Tichem; U. Staufer
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Paper Abstract

Passive alignment of photonic components is an assembly method compatible with a high production volume. Its precision performance relies completely on the dimensional accuracies of geometrical alignment features. A tolerance analysis plays a key role in designing and optimizing these passive alignment features. The objective of this paper is to develop a systematic approach for conducting such tolerance analysis, starting with a conceptual package design, setting up the tolerance chain, describing it mathematically and converting the misalignment to a coupling loss probability distribution expressed in dB. The method has successfully been applied to a case study where an indium phosphide (InP) chip is aligned with a TriPleX1 (SiO2 cladding with Si3N4 core) interposer via a silicon optical bench (SiOB).

Paper Details

Date Published: 8 September 2011
PDF: 8 pages
Proc. SPIE 8007, Photonics North 2011, 80071E (8 September 2011); doi: 10.1117/12.902756
Show Author Affiliations
J. F. C. van Gurp, Delft Univ. of Technology (Netherlands)
M. Tichem, Delft Univ. of Technology (Netherlands)
U. Staufer, Delft Univ. of Technology (Netherlands)

Published in SPIE Proceedings Vol. 8007:
Photonics North 2011
Raman Kashyap; Michel Têtu; Rafael N. Kleiman, Editor(s)

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