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Proceedings Paper

Assessment and comparison of different approaches for mask write time reduction
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Paper Abstract

The extension of 193nm exposure wavelength to smaller nodes continues the trend of increased data complexity and subsequently longer mask writing times. We review the data preparation steps post tapeout, how they influence shot count as the main driver for mask writing time and techniques to reduce that impact. The paper discusses the application of resolution enhancements and layout simplification techniques; the fracture step and optimization methods; mask writing and novel ideas for shot count reduction. The paper will describe and compare the following techniques: optimized fracture, pre-fracture jog alignment, generalization of shot definition (L-shot), multi-resolution writing, optimized-based fracture, and optimized OPC output. The comparison of shot count reduction techniques will consider the impact of changes to the current state of the art using the following criteria: computational effort, CD control on the mask, mask rule compliance for manufacturing and inspection, and the software and hardware changes required to achieve the mask write time reduction. The paper will introduce the concepts and present some data preparation results based on process correction and fracturing tools.

Paper Details

Date Published: 13 October 2011
PDF: 13 pages
Proc. SPIE 8166, Photomask Technology 2011, 816634 (13 October 2011); doi: 10.1117/12.902443
Show Author Affiliations
A. Elayat, Mentor Graphics Corp. (United States)
T. Lin, Mentor Graphics Corp. (United States)
E. Sahouria, Mentor Graphics Corp. (United States)
S. F. Schulze, Mentor Graphics Corp. (United States)

Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)

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