
Proceedings Paper
Nonsilicon micro-machined variable optical attenuatorFormat | Member Price | Non-Member Price |
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Paper Abstract
Optical power equalization between wavelength-path slots in wavelength division
multiplexing (WDM) networks is an increasingly concerning issue in all-optical networks, and
this made variable optical attenuators (VOAs) play an increasingly important role in fiber optic
transmission systems. Various types of optical attenuators have been realized, but conventional
available mechanical VOAs are bulky, costly, and slow. MOEMS technology provides new
approaches to improve the characteristic mentioned above. Previous attempts to realize MEMS
variable optical attenuators include the use of a micro-driven shutter, a mechanical antireflection
switch (MARS) modulator, a micro-machined tilted mirror, and a micro-machined membrane-type
waveguide. In this paper, we report the design and fabrication of two types of electromagnetically
actuated variable optical attenuator (VOA). They are both driven by a similar construction
containing of a plane coil and a FeNi armature. The first one adjusts the attenuation by moving a
shutter between the two fibers, the second one by moving one of the fibers directly. The first one
is fabricated by nonsilicon surface micromachining technology. In which a copper layer was used
as the sacrificial layer, and the electroplated FeNi as the structure layer. This scheme provides
another way to fabricate the optical microstructure. According to the experiment results, it has
insertion loss less than 3 dB at 1550-nm wavelength, dynamic range greater than 40 dB, 0.2-dB
repeatability, and return loss better than 40 dB, driving voltage less than 20 V. For the second one,
it included the silicon platform for adjustment of optical coupling between two optical fibers. The
main fabrication process of the silicon platform is was the KOH antistrophic wet chemical etching
of <100> silicon wafers. The silicon wafer is further selectively etched from the bottom side to
subtract the thickness of the silicon elastic platform. In addition, two V grooves were fabricated
for alignment of the input and output optical fibers. One of the V grooves is on the mobile elastic
platform; the other is on the fixed framework. When the platform is attracted downward by the
electromagnetic force, the central axes of the two fibers are mismatched to adjust the attenuation.
The insertion loss is less than 1 dB, the polarization dependent loss is less than 0.1 dB, dynamic
range is larger than 50 dB, and the driving voltage is less than 5 V. The design, fabrication, and
test of the two devices are all introduced detailedly below. The first device is suitable for fast
adjustment. The second one may be adopted in applications where, the fabrication cost and polarization-dependent loss is of more concern.
Paper Details
Date Published: 8 September 2011
PDF: 9 pages
Proc. SPIE 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies, 81912B (8 September 2011); doi: 10.1117/12.901210
Published in SPIE Proceedings Vol. 8191:
International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies
Yuelin Wang; Huikai Xie; Yufeng Jin, Editor(s)
PDF: 9 pages
Proc. SPIE 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies, 81912B (8 September 2011); doi: 10.1117/12.901210
Show Author Affiliations
Hai-lin Zhou, Shanghai Jiao Tong Univ. (China)
Xu-han Dai, Shanghai Jiao Tong Univ. (China)
Xu-han Dai, Shanghai Jiao Tong Univ. (China)
Gui-fu Ding, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Published in SPIE Proceedings Vol. 8191:
International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies
Yuelin Wang; Huikai Xie; Yufeng Jin, Editor(s)
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