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Proceedings Paper

Digital scanner infrared focal plane technology
Author(s): M. A. Ortiz; N. R. Malone; M. Harris; J. Shin; S. Byers; D. Price; J. Vampola
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Paper Abstract

Advancements in finer geometry and technology advancements in circuit design now allow placement of digital architecture on cryogenic focal planes while using less power than heritage analog designs. These advances in technology reduce the size, weight, and power of modern focal planes. In addition, the interface to the focal plane is significantly simplified and is more immune to Electromagnetic Interference (EMI). The cost of the customer's instrument after integration with the digital scanning Focal Plane Array (FPA) has been significantly reduced by placing digital architecture such as Analog to digital convertors and Low Voltage Differential Signaling (LVDS) Inputs and Outputs (I/O) on the Read Out Integrated Circuit (ROIC).

Paper Details

Date Published: 16 September 2011
PDF: 8 pages
Proc. SPIE 8154, Infrared Remote Sensing and Instrumentation XIX, 81540Q (16 September 2011); doi: 10.1117/12.897342
Show Author Affiliations
M. A. Ortiz, Raytheon Vision Systems (United States)
N. R. Malone, Raytheon Vision Systems (United States)
M. Harris, Raytheon Vision Systems (United States)
J. Shin, Raytheon Vision Systems (United States)
S. Byers, Raytheon Vision Systems (United States)
D. Price, Raytheon Vision Systems (United States)
J. Vampola, Raytheon Vision Systems (United States)

Published in SPIE Proceedings Vol. 8154:
Infrared Remote Sensing and Instrumentation XIX
Marija Strojnik; Gonzalo Paez, Editor(s)

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