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Proceedings Paper

Bottlenecks in data preparation flow for multi-beam direct write
Author(s): Dan Hung; Otto Meijer; Alex Zepka
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Paper Abstract

Technical problems with shrinking process node for semiconductor manufacturing has generated considerable interest in the use of multiple beams as an advance manufacturing technique in the context of direct write to mask / wafer. This paper examines the data preparation bottlenecks associated with this process. The various steps in the data preparation flow are described. Particular attention is paid to the large increase in data volume and the associated issues in processing power, transfer speed, storage requirements, and overall turn-around-time. Further, the use of commercial graphic processing units (GPUs) is examined as a possible solution to some of these issues and results of tests conducted as part of the MAGIC (MAskless lithoGraphy for IC manufacturing) initiative are summarized.

Paper Details

Date Published: 13 October 2011
PDF: 11 pages
Proc. SPIE 8166, Photomask Technology 2011, 81662C (13 October 2011); doi: 10.1117/12.896954
Show Author Affiliations
Dan Hung, Synopsys, Inc. (United States)
Otto Meijer, Synopsys Netherlands B.V. (United States)
Alex Zepka, Synopsys, Inc. (United States)

Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)

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