
Proceedings Paper
Fabrication of 20-nm half-pitch quartz template by nano-imprintingFormat | Member Price | Non-Member Price |
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Paper Abstract
We have been developing nanoimprint templates for the next-generation sub-20nm nanofabrication technology, with
particular emphasis on duplicate fabrication of quartz templates created from Si masters. In general, the narrowing of
pattern line widths is accompanied by concerns about whether resist will sufficiently fill such lines. Our development has
concentrated on the filling property of resist in narrow lines and on pattern shape after release from the mold. Our
findings indicated that pattern formability differs according to the type of resist monomer. We inferred that these
differences are manifested in such behaviors as resist shrinkage after or during release of the mold. Using a novel resist
that has good formability, we pursued quartz template duplication that employs UV-NIL. As a result, we demonstrated
HP20nm quartz pattern formation using the duplication process. We were also verified NIL resist pattern resolution of
HP17.5nm.
Paper Details
Date Published: 13 October 2011
PDF: 6 pages
Proc. SPIE 8166, Photomask Technology 2011, 81661V (13 October 2011); doi: 10.1117/12.896504
Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)
PDF: 6 pages
Proc. SPIE 8166, Photomask Technology 2011, 81661V (13 October 2011); doi: 10.1117/12.896504
Show Author Affiliations
Naotoshi Sato, FUJIFILM Corp. (Japan)
Tadashi Oomatsu, FUJIFILM Corp. (Japan)
Satoshi Wakamatsu, FUJIFILM Corp. (Japan)
Katsuhiro Nishimaki, FUJIFILM Corp. (Japan)
Tadashi Oomatsu, FUJIFILM Corp. (Japan)
Satoshi Wakamatsu, FUJIFILM Corp. (Japan)
Katsuhiro Nishimaki, FUJIFILM Corp. (Japan)
Toshihiro Usa, FUJIFILM Corp. (Japan)
Kunihiko Kodama, FUJIFILM Corp. (Japan)
Kazuyuki Usuki, FUJIFILM Corp. (Japan)
Kunihiko Kodama, FUJIFILM Corp. (Japan)
Kazuyuki Usuki, FUJIFILM Corp. (Japan)
Published in SPIE Proceedings Vol. 8166:
Photomask Technology 2011
Wilhelm Maurer; Frank E. Abboud, Editor(s)
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