
Proceedings Paper
Actinic EUV-mask metrology: tools, concepts, componentsFormat | Member Price | Non-Member Price |
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Paper Abstract
There is a strong demand for standalone actinic tools for mask blank and mask metrology. We expect to deliver
contributions to key issues for the infrastructure tools such as actinic reflectometer, actinic defect inspection and
components like high brightness sources together with our partners.
With our EUV-reflectometer EUV-MBR we are ready to fulfill HVM requirements in accurate and sensitive spectral
metrology. Migrating from mask blanks to masks is supported with integrated fiducial mark detection and small spot
sizes of down to < 0.03 mm2. Hence, the EUV-MBR is able to detect minimal variations on mask blank and can support
process monitoring for our partners in European EXEPT project.
For actinic blank inspection a proof of concept experiment based on an EUV microscope at BASC's EUV-Lamp allows
for comparing actinic signatures with AFM scans. Results allow for extrapolation to sub 30 nm sensitivity and fast full
blank scan.
For LPP sources we demonstrated a new concept utilizing a laser, with parameters optimized for high brightness EUV
generation and a new regenerative target concept for high position stability, gain, repetition rate operation and efficiency
in the first proof of concept experiment. Up to 350 W/(mm2 sr) from < 20 μm source size have been demonstrated.
Paper Details
Date Published: 1 April 2011
PDF: 6 pages
Proc. SPIE 7985, 27th European Mask and Lithography Conference, 79850B (1 April 2011); doi: 10.1117/12.896266
Published in SPIE Proceedings Vol. 7985:
27th European Mask and Lithography Conference
Uwe F.W. Behringer, Editor(s)
PDF: 6 pages
Proc. SPIE 7985, 27th European Mask and Lithography Conference, 79850B (1 April 2011); doi: 10.1117/12.896266
Show Author Affiliations
Rainer Lebert, Bruker Advanced Supercon GmbH (Germany)
Azadeh Farahzadi, Bruker Advanced Supercon GmbH (Germany)
Wolfgang Diete, Bruker Advanced Supercon GmbH (Germany)
David Schäfer, Univ. of Applied Sciences Koblenz (Germany)
Christoph Phiesel, Univ. of Applied Sciences Koblenz (Germany)
Thomas Wilhein, Univ. of Applied Sciences Koblenz (Germany)
Azadeh Farahzadi, Bruker Advanced Supercon GmbH (Germany)
Wolfgang Diete, Bruker Advanced Supercon GmbH (Germany)
David Schäfer, Univ. of Applied Sciences Koblenz (Germany)
Christoph Phiesel, Univ. of Applied Sciences Koblenz (Germany)
Thomas Wilhein, Univ. of Applied Sciences Koblenz (Germany)
Stefan Herbert, RWTH Aachen Univ. (Germany)
Aleksey Maryasov, RWTH Aachen Univ. (Germany)
Larissa Juschkin, RWTH Aachen Univ. (Germany)
Dominik Esser, Fraunhofer Institute for Laser Technology (Germany)
Marco Hoefer, Fraunhofer Institute for Laser Technology (Germany)
Dieter Hoffmann, Fraunhofer Institute for Laser Technology (Germany)
Aleksey Maryasov, RWTH Aachen Univ. (Germany)
Larissa Juschkin, RWTH Aachen Univ. (Germany)
Dominik Esser, Fraunhofer Institute for Laser Technology (Germany)
Marco Hoefer, Fraunhofer Institute for Laser Technology (Germany)
Dieter Hoffmann, Fraunhofer Institute for Laser Technology (Germany)
Published in SPIE Proceedings Vol. 7985:
27th European Mask and Lithography Conference
Uwe F.W. Behringer, Editor(s)
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