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Proceedings Paper

Thermal-contact-conductance measurement for high-heat-load optics components at SPring-8
Author(s): T. Takeuchi; M. Tanaka; Y. Senba; H. Ohashi; S. Goto
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Paper Abstract

Thermal contact in water-cooling or cryogenic cooling-cooling condition is used for forming a high-heat-load component at the synchrotron radiation beamline. In SPring-8, for example, cryogenic cooling is used for silicon monochromator crystal with an indium insertion metal at the interface between a copper block and a silicon crystal. To reduce the strain on the silicon crystal with a low contact pressure and a high thermal conductivity, we require a silicon-indium-copper system and an alternative insertion material such as a graphite foil. To measure the thermal contact conductance in a quick measurement cycle under various thermal-contact conditions, we improve the thermal-contact-conductance measurement system in terms of the setup facilitation, precise temperature measurement, and thermal insulation around a sample.

Paper Details

Date Published: 28 September 2011
PDF: 6 pages
Proc. SPIE 8139, Advances in X-Ray/EUV Optics and Components VI, 813911 (28 September 2011); doi: 10.1117/12.894612
Show Author Affiliations
T. Takeuchi, Japan Synchrotron Radiation Research Institute (Japan)
M. Tanaka, Japan Synchrotron Radiation Research Institute (Japan)
Y. Senba, Japan Synchrotron Radiation Research Institute (Japan)
H. Ohashi, Japan Synchrotron Radiation Research Institute (Japan)
S. Goto, Japan Synchrotron Radiation Research Institute (Japan)


Published in SPIE Proceedings Vol. 8139:
Advances in X-Ray/EUV Optics and Components VI
Christian Morawe; Ali M. Khounsary; Shunji Goto, Editor(s)

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