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Proceedings Paper

The thermal dissipation of LED under the influence of ceramic porous film
Author(s): Ming-Seng Hsu; Chung-Chih Chang; Feng-Lin Shyu; Yau-Chyr Wang
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Paper Abstract

The temperature had an important influence in the life time of light emitting diodes (LED). In this study, we fabricated the ceramic porous films, by vacuum sputtering, soldered the LED lamps to enhance both of the heat transfer and heat dissipation. In our samples, the ceramic enables transfer the heat from electric device to the aluminum plate quickly and the porous increase the quality of the thermal dissipation between the PCB and aluminum plate, as compared to the industrial processing. The ceramic films were characterized by several subsequent analyses, especially the measurement of real work temperature. The X-Ray diffraction (XRD) diagram analysis reveals those ceramic phases were successfully grown onto the individual substrate. The morphology of ceramic films was investigated by the atomic force microscopy (AFM). The results show porous film fabricated by vacuum sputtering has high sheet resistivity, critical load, and thermal conduction to the purpose. At the same time, it had transferred heat and limited work temperature, ~80°C, of LED successfully.

Paper Details

Date Published: 7 September 2011
PDF: 6 pages
Proc. SPIE 8120, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications V, 81201G (7 September 2011); doi: 10.1117/12.893828
Show Author Affiliations
Ming-Seng Hsu, Chinese Military Academy (Taiwan)
Chung-Chih Chang, Chinese Military Academy (Taiwan)
Feng-Lin Shyu, Chinese Military Academy (Taiwan)
Yau-Chyr Wang, Nan-Jeon Institute of Technology (Taiwan)

Published in SPIE Proceedings Vol. 8120:
Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications V
Shizhuo Yin; Ruyan Guo, Editor(s)

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