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Proceedings Paper

Automated 3D IR defect mapping system for CZT wafer and tile inspection and characterization
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Paper Abstract

In this paper, the design and evaluation of a 3D stereo, near infrared (IR), defect mapping system for CZT inspection is described. This system provides rapid acquisition and data analysis that result in detailed mapping of CZT crystal defects across the area of wafers up to 100 millimeter diameter and through thicknesses of up to 20 millimeter. In this paper, system characterization has been performed including a close evaluation of the bright field and dark field illumination configurations for both wafer-scale and tile-scale inspection. A comparison of microscope image and IR image for the same sample is performed. As a result, the IR inspection system has successfully demonstrated the capability of detecting and localizing inclusions within minutes for a whole CZT wafer. Important information is provided for selecting defect free areas out of a wafer and thereby ensuring the quality of the tile. This system would support the CZT wafer dicing and assembly techniques that enable the economical production of CZT detectors. This capability can improve the yield and reduce the cost of the thick detector devices that are rarely produced today.

Paper Details

Date Published: 14 September 2011
PDF: 12 pages
Proc. SPIE 8133, Dimensional Optical Metrology and Inspection for Practical Applications, 81330P (14 September 2011); doi: 10.1117/12.892765
Show Author Affiliations
Yi Liao, GE Global Research (United States)
Esmaeil Heidari, GE Global Research (United States)
Gil Abramovich, GE Global Research (United States)
Christopher Nafis, GE Global Research (United States)
Amer Butt, GE Global Research (United States)
Joseph Czechowski, GE Global Research (United States)
Kevin Harding, GE Global Research (United States)
J. Eric Tkaczyk, GE Global Research (United States)

Published in SPIE Proceedings Vol. 8133:
Dimensional Optical Metrology and Inspection for Practical Applications
Kevin G. Harding; Peisen S. Huang; Toru Yoshizawa, Editor(s)

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