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Proceedings Paper

MEMS performance challenges: packaging and shock tests
Author(s): Jiyoung Chang; Chen Yang; Bin Zhang; Liwei Lin
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Paper Abstract

This paper describes recent advances in the MEMS performance challenges with emphases on packaging and shock tests. In the packaging area, metal to metal bonding processes have been developed to overcome limitations of the glass frit bonding by means of two specific methods: (1) pre-reflow of solder for enhanced bonding adhesion, and (2) the insertion of thin metal layer between parent metal bonding materials. In the shock test area, multiscale analysis for a MEMS package system has been developed with experimental verifications to investigate dynamic responses under drop-shock tests. Structural deformation and stress distribution data are extracted and predicted for device fracture and in-operation stiction analyses for micro mechanical components in various MEMS sensors, including accelerometers and gyroscopes.

Paper Details

Date Published: 13 May 2011
PDF: 8 pages
Proc. SPIE 8031, Micro- and Nanotechnology Sensors, Systems, and Applications III, 80311F (13 May 2011); doi: 10.1117/12.885552
Show Author Affiliations
Jiyoung Chang, Univ. of California, Berkeley (United States)
Chen Yang, Univ. of California, Berkeley (United States)
Bin Zhang, Univ. of California, Berkeley (United States)
Liwei Lin, Univ. of California, Berkeley (United States)


Published in SPIE Proceedings Vol. 8031:
Micro- and Nanotechnology Sensors, Systems, and Applications III
Thomas George; M. Saif Islam; Achyut K. Dutta, Editor(s)

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