
Proceedings Paper
Analysis of the polishing slurry flow of chemical mechanical polishing by polishing pad with phyllotactic patternFormat | Member Price | Non-Member Price |
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Paper Abstract
In order to make the polishing slurry distribution more uniform over the polishing region, a new kind of polishing pad,
which has sunflower seed pattern, has been designed based on the phyllotaxis theory of biology, and the boundary
conditions of polishing slurry flow have been established. By the help of computational fluid dynamics software
(FLUENT), the flow state of the polishing slurry is simulated and the effects of the phyllotactic parameters of polishing
pad on the flow field of polishing slurry are analyzed. The results show that when the polishing slurry is imported from
the center of phyllotaxis polishing pad, the slurry flows along the counterclockwise and clockwise spiral grooves of
phyllotatic pattern, which make fluid flow divergence around, and the flow field becomes more uniform.
Paper Details
Date Published: 26 May 2011
PDF: 6 pages
Proc. SPIE 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering, 79972V (26 May 2011); doi: 10.1117/12.883091
Published in SPIE Proceedings Vol. 7997:
Fourth International Seminar on Modern Cutting and Measurement Engineering
Jiezhi Xin; Lianqing Zhu; Zhongyu Wang, Editor(s)
PDF: 6 pages
Proc. SPIE 7997, Fourth International Seminar on Modern Cutting and Measurement Engineering, 79972V (26 May 2011); doi: 10.1117/12.883091
Show Author Affiliations
Yushan Lv, Shenyang Ligong Univ. (China)
Tian Zhang, Shenyang Ligong Univ. (China)
Jun Wang, Shenyang Ligong Univ. (China)
Tian Zhang, Shenyang Ligong Univ. (China)
Jun Wang, Shenyang Ligong Univ. (China)
Nan Li, Shenyang Ligong Univ. (China)
Min Duan, Shenyang Ligong Univ. (China)
Xue-Ling Xing, Shenyang Ligong Univ. (China)
Min Duan, Shenyang Ligong Univ. (China)
Xue-Ling Xing, Shenyang Ligong Univ. (China)
Published in SPIE Proceedings Vol. 7997:
Fourth International Seminar on Modern Cutting and Measurement Engineering
Jiezhi Xin; Lianqing Zhu; Zhongyu Wang, Editor(s)
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