
Proceedings Paper
A novel atomic layer deposition method to fabricate economical and robust large area microchannel platesFormat | Member Price | Non-Member Price |
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Paper Abstract
We demonstrate a cost-effective and robust route to fabricate large-area microchannel plate (MCP) detectors, which
will open new potential in larger area MCP-based detector technologies. For the first time, using our newly
developed process flow we have fabricated large area (8"x8") MCPs. We used atomic layer deposition (ALD), a
powerful thin film deposition technique, to tailor the electrical resistance and secondary electron emission (SEE)
properties of large area, low cost, borosilicate glass capillary arrays. The self limiting growth mechanism in ALD
allows atomic level control over the thickness and composition of resistive and SEES layers that can be deposited
conformally on high aspect ratio capillary glass arrays. We have developed several robust and reliable ALD
processes for the resistive coatings and SEE layers to give us precise control over the resistance (106-1010Ω) and
SEE coefficient (up to 5). This novel approach allows the functionalization of microporous, insulating substrates to
produce MCPs with high gain and low noise. These capabilities allow a separation of the substrate material
properties from the amplification properties. Here we describe a complete process flow to produce large area MCPs.
Paper Details
Date Published: 13 May 2011
PDF: 7 pages
Proc. SPIE 8031, Micro- and Nanotechnology Sensors, Systems, and Applications III, 80312H (13 May 2011); doi: 10.1117/12.882885
Published in SPIE Proceedings Vol. 8031:
Micro- and Nanotechnology Sensors, Systems, and Applications III
Thomas George; M. Saif Islam; Achyut K. Dutta, Editor(s)
PDF: 7 pages
Proc. SPIE 8031, Micro- and Nanotechnology Sensors, Systems, and Applications III, 80312H (13 May 2011); doi: 10.1117/12.882885
Show Author Affiliations
Anil U. Mane, Argonne National Lab. (United States)
Qing Peng, Argonne National Lab. (United States)
Matthew J. Wetstein, Argonne National Lab. (United States)
Univ. of Chicago (United States)
Robert G. Wagner, Argonne National Lab. (United States)
Henry J. Frisch, Argonne National Lab. (United States)
Univ. of Chicago (United States)
Qing Peng, Argonne National Lab. (United States)
Matthew J. Wetstein, Argonne National Lab. (United States)
Univ. of Chicago (United States)
Robert G. Wagner, Argonne National Lab. (United States)
Henry J. Frisch, Argonne National Lab. (United States)
Univ. of Chicago (United States)
Oswald H. W. Siegmund, Univ. of California, Berkeley (United States)
Michael J. Minot, Incom Inc. (United States)
Bernhard W. Adams, Argonne National Lab. (United States)
Matthieu C. Chollet, Argonne National Lab. (United States)
Jeffrey W. Elam, Argonne National Lab. (United States)
Michael J. Minot, Incom Inc. (United States)
Bernhard W. Adams, Argonne National Lab. (United States)
Matthieu C. Chollet, Argonne National Lab. (United States)
Jeffrey W. Elam, Argonne National Lab. (United States)
Published in SPIE Proceedings Vol. 8031:
Micro- and Nanotechnology Sensors, Systems, and Applications III
Thomas George; M. Saif Islam; Achyut K. Dutta, Editor(s)
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