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Proceedings Paper

Laboratory validation of MEMS-based sensors for post-earthquake damage assessment
Author(s): Matteo Pozzi; Daniele Zonta; Juan Santana; Mikael Colin; Nicolas Saillen; Tom Torfs; Angelos Amditis; Matthaios Bimpas; Yorgos Stratakos; Dumitru Ulieru; Dimitirs Bairaktaris; Stamatia Frondistou-Yannas; Vasilis Kalidromitis
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Paper Abstract

The evaluation of seismic damage is today almost exclusively based on visual inspection, as building owners are generally reluctant to install permanent sensing systems, due to their high installation, management and maintenance costs. To overcome this limitation, the EU-funded MEMSCON project aims to produce small size sensing nodes for measurement of strain and acceleration, integrating Micro-Electro-Mechanical Systems (MEMS) based sensors and Radio Frequency Identification (RFID) tags in a single package that will be attached to reinforced concrete buildings. To reduce the impact of installation and management, data will be transmitted to a remote base station using a wireless interface. During the project, sensor prototypes were produced by assembling pre-existing components and by developing ex-novo miniature devices with ultra-low power consumption and sensing performance beyond that offered by sensors available on the market. The paper outlines the device operating principles, production scheme and working at both unit and network levels. It also reports on validation campaigns conducted in the laboratory to assess system performance. Accelerometer sensors were tested on a reduced scale metal frame mounted on a shaking table, back to back with reference devices, while strain sensors were embedded in both reduced and full-scale reinforced concrete specimens undergoing increasing deformation cycles up to extensive damage and collapse. The paper assesses the economical sustainability and performance of the sensors developed for the project and discusses their applicability to long-term seismic monitoring.

Paper Details

Date Published: 13 April 2011
PDF: 10 pages
Proc. SPIE 7981, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011, 79810Y (13 April 2011); doi: 10.1117/12.882015
Show Author Affiliations
Matteo Pozzi, Univ. degli Studi di Trento (Italy)
Daniele Zonta, Univ. degli Studi di Trento (Italy)
Juan Santana, Imec-Holst Ctr. (Netherlands)
Mikael Colin, MEMSCAP (France)
Nicolas Saillen, Thermo Fisher Scientific (Netherlands)
Tom Torfs, IMEC (Belgium)
Angelos Amditis, National Technical Univ. of Athens (Greece)
Matthaios Bimpas, National Technical Univ. of Athens (Greece)
Yorgos Stratakos, Advanced Microwave Systems, Ltd. (Greece)
Dumitru Ulieru, SITEX 45 SRL (Romania)
Dimitirs Bairaktaris, Bairaktaris and Associates Ltd. (Greece)
Stamatia Frondistou-Yannas, RISA Sicherheitsanalysen GmbH (Germany)
Vasilis Kalidromitis, TECNIC S.p.A (Italy)

Published in SPIE Proceedings Vol. 7981:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2011
Masayoshi Tomizuka, Editor(s)

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