Share Email Print

Proceedings Paper

Metrology characterization of spacer double patterning by scatterometry
Author(s): Prasad Dasari; Jie Li; Jiangtao Hu; Zhuan Liu; Oleg Kritsun; Catherine Volkman
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Spacer defined double patterning processes consists of multiple deposition, post strips and etch steps and is inherently susceptible to the cumulative effects of defects from each process step leading to higher rate of defect detection. CD distortions and CD non-uniformity leads to DPT overlay errors. This demands improved critical dimension uniformity (CDU) and overlay control. Scatterometry technique enables the characterization and control the CD uniformity and provision to monitor stepper and scanner characteristics such as focus and dose control. While CDSEM is capable of characterizing CD and sidewall angle, is not adequate to resolve shape variations, such as footing and top rounding and spacers with leaning angles, during the intermediate process steps. We will characterize direct low temperature oxide deposition on resist spacer with fewer core films and reduced number of processing and metrology control steps. Metrology characterization of SADP and resist core transferred spacers at various process steps will be performed by scatterometry using spectroscopic ellipsometry and reflectometry. We will present CD distribution (CDU) and profile characterization for core formation, spacer deposition and etch by advanced optical scatterometry and also validate against CDSEM.

Paper Details

Date Published: 20 April 2011
PDF: 12 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797111 (20 April 2011); doi: 10.1117/12.879900
Show Author Affiliations
Prasad Dasari, Nanometrics Inc. (United States)
Jie Li, Nanometrics Inc. (United States)
Jiangtao Hu, Nanometrics Inc. (United States)
Zhuan Liu, Nanometrics Inc. (United States)
Oleg Kritsun, GLOBALFOUNDRIES Inc. (United States)
Catherine Volkman, GLOBALFOUNDRIES Inc. (United States)

Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?