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Proceedings Paper

Application of mask process correction (MPC) to monitor and correct mask process drift
Author(s): Timothy Lin; Tom Donnelly; Gordon Russell; Sunwook Jung; Jiyoung Jeong
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Paper Abstract

Temporal drift in the mask manufacturing process has been observed in CD measurements collected at different times. Most of this is corrected through global sizing and dose adjustments resulting in small mean-to-target (MTT) residual errors. However, this procedure does not account for a detectable change in the proximity behavior of the mask process. This paper discusses a procedure for detecting and monitoring the proximity behavior of a process using an targeted sampling plan. It also proposes a procedure to correct for drifts in proximity behavior if it is predictable and systematic.

Paper Details

Date Published: 28 March 2011
PDF: 7 pages
Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797107 (28 March 2011); doi: 10.1117/12.879119
Show Author Affiliations
Timothy Lin, Mentor Graphics Corp. (United States)
Tom Donnelly, Mentor Graphics Corp. (United States)
Gordon Russell, Mentor Graphics Corp. (United States)
Sunwook Jung, Mentor Korea Co., Ltd. (Korea, Republic of)
Jiyoung Jeong, Mentor Korea Co., Ltd. (Korea, Republic of)

Published in SPIE Proceedings Vol. 7971:
Metrology, Inspection, and Process Control for Microlithography XXV
Christopher J. Raymond, Editor(s)

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