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Proceedings Paper

Hybrid photonic integrated circuits for faster and greener optical communication networks
Author(s): L. Stampoulidis; E. Kehayas; L. Zimmermann
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Paper Abstract

We present current development efforts on hybrid photonic integration for new generation "faster and greener" Tb/scapacity optical networks. On the physical layer, we present the development of a versatile, silicon-based photonic integration platform that acts as a technology "blender" bringing together different material systems including III-V and silicon-based semiconductors. The platform is also used to implement the so-called O-to-O (optical-to-optical) functionalities by patterning low-loss passive components such as MMI couplers and delay interferometers. With these passive building blocks as well as the ability for hybrid assembly of active material, we demonstrate the fabrication of key optical transport and routing devices such as optical demodulators and all-optical wavelength converters. These devices can now be used to fabricate chip-scale 100 GbE transceiver PICs and Tb/s-capacity wavelength switching platforms.

Paper Details

Date Published: 17 January 2011
PDF: 7 pages
Proc. SPIE 7941, Integrated Optics: Devices, Materials, and Technologies XV, 79410C (17 January 2011); doi: 10.1117/12.876824
Show Author Affiliations
L. Stampoulidis, CONSTELEX Technology Enablers (Greece)
E. Kehayas, CONSTELEX Technology Enablers (Greece)
L. Zimmermann, IHP GmbH (Germany)
Technische Univ. Berlin (Germany)

Published in SPIE Proceedings Vol. 7941:
Integrated Optics: Devices, Materials, and Technologies XV
Jean Emmanuel Broquin; Gualtiero Nunzi Conti, Editor(s)

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