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Proceedings Paper

Large-scale planar lightwave circuits
Author(s): Serge Bidnyk; Hua Zhang; Matt Pearson; Ashok Balakrishnan
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Paper Abstract

By leveraging advanced wafer processing and flip-chip bonding techniques, we have succeeded in hybrid integrating a myriad of active optical components, including photodetectors and laser diodes, with our planar lightwave circuit (PLC) platform. We have combined hybrid integration of active components with monolithic integration of other critical functions, such as diffraction gratings, on-chip mirrors, mode-converters, and thermo-optic elements. Further process development has led to the integration of polarization controlling functionality. Most recently, all these technological advancements have been combined to create large-scale planar lightwave circuits that comprise hundreds of optical elements integrated on chips less than a square inch in size.

Paper Details

Date Published: 27 January 2011
PDF: 7 pages
Proc. SPIE 7941, Integrated Optics: Devices, Materials, and Technologies XV, 794102 (27 January 2011); doi: 10.1117/12.871803
Show Author Affiliations
Serge Bidnyk, Enablence Inc. (Canada)
Hua Zhang, Enablence Inc. (Canada)
Matt Pearson, Enablence Inc. (Canada)
Ashok Balakrishnan, Enablence Inc. (Canada)

Published in SPIE Proceedings Vol. 7941:
Integrated Optics: Devices, Materials, and Technologies XV
Jean Emmanuel Broquin; Gualtiero Nunzi Conti, Editor(s)

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