Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume of low cost camera market where weight, power and cost reduction are of importance. Since the first proof of the pixel level packaging for uncooled IRFPA in 2008, CEA-LETI, MINATEC is still strongly involved in an innovative packaging technology. The main point is that no additional technological steps are necessary to integrate the FPA chip under vacuum as the microbolometer process comprises itself the vacuum integration at the pixel level. Moreover, to keep the vacuum level around each microbolometer a thin film getter is deposited. This paper presents the recent development at CEA-LETI, MINATEC of this innovative packaging technology with getter inside.

Date Published: 27 October 2010
PDF: 8 pages
Proc. SPIE 7834, Electro-Optical and Infrared Systems: Technology and Applications VII, 78340T (27 October 2010); doi: 10.1117/12.868462

Published in SPIE Proceedings Vol. 7834:
Electro-Optical and Infrared Systems: Technology and Applications VII
David A. Huckridge; Reinhard R. Ebert, Editor(s)