
Proceedings Paper
Two-fluid cleaning technology for advanced photomaskFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
The recent trend towards the shrinkage of semiconductor devices is sparking the miniaturization of photomask patterns.
In turn, this has resulted in a demand for photomask cleaning technology that can eliminate contamination without
causing damage, such as mask pattern collapsing and degradation of photomask optical properties. A two-fluid cleaning
technology that can remove contamination without causing pattern collapsing has been gaining attention as a recent
physical cleaning technology. It is now known that the advanced technology photomask cleaning is possible by
controlling the diameter and the flow velocity of the liquid droplets discharged from the nozzle with two-fluid cleaning.
However, it becomes impossible to explain damage only by the diameter of liquid droplets and flow velocity. In order to
achieve a further improvement of the two-fluid cleaning technology, it is necessary to understand the mechanism of the
damage accurately. We pay attention the study on a new parameter of damage and particle removal. The new parameter
is liquid film thickness. We can rigorously describe the relation between damage and particle removal in terms of liquid
droplet diameter, flow velocity and liquid film thickness by this study.
Paper Details
Date Published: 26 May 2010
PDF: 9 pages
Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 77480Z (26 May 2010); doi: 10.1117/12.867980
Published in SPIE Proceedings Vol. 7748:
Photomask and Next-Generation Lithography Mask Technology XVII
Kunihiro Hosono, Editor(s)
PDF: 9 pages
Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 77480Z (26 May 2010); doi: 10.1117/12.867980
Show Author Affiliations
Yuji Nagashima, Shibaura Mechatronics Corp. (Japan)
Koichi Higuchi, Shibaura Mechatronics Corp. (Japan)
Tsutomu Kikuchi, Shibaura Mechatronics Corp. (Japan)
Koichi Higuchi, Shibaura Mechatronics Corp. (Japan)
Tsutomu Kikuchi, Shibaura Mechatronics Corp. (Japan)
Yoshiaki Kurokawa, Shibaura Mechatronics Corp. (Japan)
Harumichi Hirose, Shibaura Mechatronics Corp. (Japan)
Mikio Nonaka, Shibaura Mechatronics Corp. (Japan)
Harumichi Hirose, Shibaura Mechatronics Corp. (Japan)
Mikio Nonaka, Shibaura Mechatronics Corp. (Japan)
Published in SPIE Proceedings Vol. 7748:
Photomask and Next-Generation Lithography Mask Technology XVII
Kunihiro Hosono, Editor(s)
© SPIE. Terms of Use
