
Proceedings Paper
3D face recognition for security and defense engineeringFormat | Member Price | Non-Member Price |
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Paper Abstract
Face recognition based on 2D images is a difficult problem, because the illumination, pose and expression changes in the
images create great statistical differences and the identity of the face itself becomes shadowed by these factors. 3D face
recognition has the potential to overcome feature localization, pose and illumination problems, and it can be used in
conjunction with 2D systems. We review the relevant work on 3D face recognition here, and discuss merits and demerits
of different representations and recognition algorithms. This survey focuses on 3D face data acquisition and 3D face
recognition using histogram features. Future works involved in developing more accurate 3D face recognition are also
discussed. These include the need for improved 3D face data acquisition, 3D face recognition algorithms and 3D face
experimental methodology.
Paper Details
Date Published: 19 August 2010
PDF: 8 pages
Proc. SPIE 7820, International Conference on Image Processing and Pattern Recognition in Industrial Engineering, 78201H (19 August 2010); doi: 10.1117/12.866650
Published in SPIE Proceedings Vol. 7820:
International Conference on Image Processing and Pattern Recognition in Industrial Engineering
Shaofei Wu; Zhengyu Du; Shaofei Wu; Zhengyu Du; Shaofei Wu; Zhengyu Du, Editor(s)
PDF: 8 pages
Proc. SPIE 7820, International Conference on Image Processing and Pattern Recognition in Industrial Engineering, 78201H (19 August 2010); doi: 10.1117/12.866650
Show Author Affiliations
Xilai Li, Xi'an Hongqing High Technology Institute (China)
Aihua Li, Xi'an Hongqing High Technology Institute (China)
Aihua Li, Xi'an Hongqing High Technology Institute (China)
Xiangfeng Bai, Xi'an Hongqing High Technology Institute (China)
Published in SPIE Proceedings Vol. 7820:
International Conference on Image Processing and Pattern Recognition in Industrial Engineering
Shaofei Wu; Zhengyu Du; Shaofei Wu; Zhengyu Du; Shaofei Wu; Zhengyu Du, Editor(s)
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