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Proceedings Paper

CZT smart dicing strategy for cost reduction using defect imaging and random-access machining
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Paper Abstract

Current spectroscopic detector crystals contain defects that prevent economic production of devices with sufficient energy resolution and stopping power for radioisotope discrimination. This is especially acute for large monolithic crystals due to increased defect opportunity. The proposed approach to cost reduction starts by combining stereoscopic IR and ultrasound (UT) inspection coupled with segmentation and 3D mapping algorithms. A "smart dicing" system uses "random-access" laser-based machining to obtain tiles free of major defects. Application specific grading matches defect type to anticipated performance. Small pieces combined in a modular sensor pack instead of a monolith will make the most efficient use of wafer area.

Paper Details

Date Published: 2 September 2010
PDF: 10 pages
Proc. SPIE 7806, Penetrating Radiation Systems and Applications XI, 78060L (2 September 2010); doi: 10.1117/12.865861
Show Author Affiliations
J. Eric Tkaczyk, GE Global Research (United States)
Kristian Andreini, GE Global Research (United States)
Tan Zhang, GE Global Research (United States)
Kevin G. Harding, GE Global Research (United States)
Gil Abramovich, GE Global Research (United States)
Yana Williams, GE Global Research (United States)
Christopher A. Nafis, GE Global Research (United States)
Wenwu Zhang, GE Global Research (United States)

Published in SPIE Proceedings Vol. 7806:
Penetrating Radiation Systems and Applications XI
F. Patrick Doty; H. Bradford Barber; Hans Roehrig; Richard C. Schirato, Editor(s)

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