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Proceedings Paper

The relationship between mounting pressure and time on final photomask flatness
Author(s): Takashi Mizoguchi; Monica Barrett; Satoshi Akutagawa; Michael Caterer; Robert Nolan; Dennis Plouffe; Nancy Zhou
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Paper Abstract

Photomask flatness and image placement specifications for advanced technology masks are becoming more stringent. Therefore, it is important to understand the various factors that affect final photomask flatness due to the direct impact it has on image placement. Past studies have demonstrated that final photomask flatness can be controlled by modifying the mounting process of photomask pellicle as well as changing the pellicle material itself [1][2][3][4]. In particular, our previous results demonstrate the ability to successfully eliminate data deviations by remounting the same pellicle for each experiment. This paper focuses on the relationship between mounting pressure and time on final photomask flatness. Our initial results indicate that mounting time has minimal influence on final photomask flatness; however, final photomask flatness is greatly impacted by varying mounting pressure. Finally we explore the relationship between the final photomask flatness and the image placement for post pellicle mounting onto the photomask.

Paper Details

Date Published: 25 May 2010
PDF: 8 pages
Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 77480C (25 May 2010); doi: 10.1117/12.865005
Show Author Affiliations
Takashi Mizoguchi, Toppan Photomasks, Inc. (United States)
Monica Barrett, IBM Corp. (United States)
Satoshi Akutagawa, Toppan Photomasks, Inc. (United States)
Michael Caterer, IBM Corp. (United States)
Robert Nolan, IBM Corp. (United States)
Dennis Plouffe, IBM Corp. (United States)
Nancy Zhou, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 7748:
Photomask and Next-Generation Lithography Mask Technology XVII
Kunihiro Hosono, Editor(s)

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