
Proceedings Paper
Performance improvements of binary diffractive structures via optimization of the photolithography and dry etch processesFormat | Member Price | Non-Member Price |
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Paper Abstract
Increasingly stringent requirements on the performance of diffractive optical elements (DOEs) used in wafer scanner
illumination systems are driving continuous improvements in their associated manufacturing processes. Specifically,
these processes are designed to improve the output pattern uniformity of off-axis illumination systems to minimize
degradation in the ultimate imaging performance of a lithographic tool. In this paper, we discuss performance
improvements in both photolithographic patterning and RIE etching of fused silica diffractive optical structures. In
summary, optimized photolithographic processes were developed to increase critical dimension uniformity and featuresize
linearity across the substrate. The photoresist film thickness was also optimized for integration with an improved
etch process. This etch process was itself optimized for pattern transfer fidelity, sidewall profile (wall angle, trench
bottom flatness), and across-wafer etch depth uniformity. Improvements observed with these processes on idealized test
structures (for ease of analysis) led to their implementation in product flows, with comparable increases in performance
and yield on customer designs.
Paper Details
Date Published: 16 August 2010
PDF: 12 pages
Proc. SPIE 7789, Laser Beam Shaping XI, 778906 (16 August 2010); doi: 10.1117/12.859893
Published in SPIE Proceedings Vol. 7789:
Laser Beam Shaping XI
Andrew Forbes; Todd E. Lizotte, Editor(s)
PDF: 12 pages
Proc. SPIE 7789, Laser Beam Shaping XI, 778906 (16 August 2010); doi: 10.1117/12.859893
Show Author Affiliations
Richard D. Jones, Tessera (United States)
Published in SPIE Proceedings Vol. 7789:
Laser Beam Shaping XI
Andrew Forbes; Todd E. Lizotte, Editor(s)
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