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Proceedings Paper

Fabrication of 3D nanostructures with lithographically patterned surfaces by self-folding
Author(s): Jeong-Hyun Cho; Teena James; D. H. Gracias
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Paper Abstract

One of the important challenges in nanoscale manufacturing is the construction of simultaneously patterned three dimensional structures, materials and devices. Since we live in a three dimensional world, such capabilities are needed to fully realize the capabilities of nanotechnology. We describe self-assembly processes based on utilizing intrinsic stress and inducing grain coalescence (extrinsic stress) in thin metal films that can be used to curve or fold lithographically patterned two dimensional (2D) panels into 3D structures. We discuss the use of intrinsic chromium (Cr) stresses and extrinsic stresses based on induced grain coalescence in tin (Sn) based structures with varying material composition to create a variety of lithographically patterned curved and polyhedral structures.

Paper Details

Date Published: 24 August 2010
PDF: 6 pages
Proc. SPIE 7767, Instrumentation, Metrology, and Standards for Nanomanufacturing IV, 776704 (24 August 2010); doi: 10.1117/12.859688
Show Author Affiliations
Jeong-Hyun Cho, The Johns Hopkins Univ. (United States)
Teena James, The Johns Hopkins Univ. (United States)
D. H. Gracias, The Johns Hopkins Univ. (United States)

Published in SPIE Proceedings Vol. 7767:
Instrumentation, Metrology, and Standards for Nanomanufacturing IV
Michael T. Postek, Editor(s)

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