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Proceedings Paper

Polycarbonate based nonchemically amplified photoresists for extreme ultraviolet lithography
Author(s): Idriss Blakey; Anguang Yu; James Blinco; Kevin S. Jack; Heping Liu; Michael Leeson; Wang Yueh; Todd Younkin; Andrew K. Whittaker
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Paper Abstract

Some initial EUVL patterning results for polycarbonate based non-chemically amplified resists are presented. Without full optimization the developer a resolution of 60 nm line spaces could be obtained. With slight overexposure (1.4 × E0) 43.5 nm lines at a half pitch of 50 nm could be printed. At 2x E0 a 28.6 nm lines at a half pitch of 50 nm could be obtained with a LER that was just above expected for mask roughness. Upon being irradiated with EUV photons, these polymers undergo chain scission with the loss of carbon dioxide and carbon monoxide. The remaining photoproducts appear to be non-volatile under standard EUV irradiation conditions, but do exhibit increased solubility in developer compared to the unirradiated polymer. The sensitivity of the polymers to EUV light is related to their oxygen content and ways to increase the sensitivity of the polymers to 10 mJ cm-2 is discussed.

Paper Details

Date Published: 22 March 2010
PDF: 8 pages
Proc. SPIE 7636, Extreme Ultraviolet (EUV) Lithography, 763635 (22 March 2010); doi: 10.1117/12.853620
Show Author Affiliations
Idriss Blakey, The Univ. of Queensland (Australia)
Anguang Yu, The Univ. of Queensland (Australia)
James Blinco, The Univ. of Queensland (Australia)
Kevin S. Jack, The Univ. of Queensland (Australia)
Heping Liu, The Univ. of Queensland (Australia)
Michael Leeson, Intel Corp. (United States)
Wang Yueh, Intel Corp. (United States)
Todd Younkin, Intel Corp. (United States)
Andrew K. Whittaker, The Univ. of Queensland (Australia)

Published in SPIE Proceedings Vol. 7636:
Extreme Ultraviolet (EUV) Lithography
Bruno M. La Fontaine, Editor(s)

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